Polishing kit

ABSTRACT

A polishing kit formed of a folder having a plurality of layers superimposed thereon. A base layer forms a support upon which a receptacle layer having a recess therein is positioned. Polishing material is placed in the receptacle layer recess and the receptacle layer is then covered with a protective layer of material such as transparent pressure-sensitive plastic material. A felt applicator may be placed on the top surface of the pressure-sensitive material and the superimposed layers mounted in a match-book type folder.

ttves 1 atent [191 Young May 7, 1974 POLISHING KIT 2,044,428 6/1936 Gilmer 401/7 x [76] Inventor: Jesse R. Young, 5302 W. 138th St.,

Hawthorne, C lm 90250 Primary ExaminerLawrence Charles v Attorney, Agent, or Firm-Nilsson, Robbins & Berliner [22] Filed: Nov. 17, 1972 [21] Appl. No.: 307,679 [57] I ABSTRACT A polishing kit formed of a folder havinga plurality of [52] U.S.Cl ...1.640l/ l23,3g1b04.g8 layers Superimposed thereon A base layer forms a A b support up a ecepta layer having a recess [58] Fleld of Search 401/7 therein is positioned. Polishing material is placed in 401/118 15/10494 the receptacle layer recess and the receptacle layer is then covered with a protective layer of material such [56] References C'ted as transparent pressure-sensitive plastic material. A UNITED STATES PATENTS felt applicator may be placed on the top surface of the 3,078,495 2/1963 Halbach 401/7 X pressure-sensitive material and the superimposed lay- 2,631,322 3/l953 Kaheny... 15/l04.94 erg mounted in a match-book type folder. 3,308,837 3/l967 Sclleck.... l5/l04.94

2,491,864 12/1949 Kreidler 157104.94 1 Claim, 3 Drawing Figures POLISHING KIT BACKGROUND OF THE INVENTION 1. Field of the Invention The field of art to which the invention pertains includes the field of polishing-kits, particularly with respect to a folder containing a disposable shoe polishing kit.

2. Background of the Invention The best known prior art includes U.S. Pat. Nos. 1,524,008; 2,839,774; 2,523,909; 1,813,047; and 2,351,407.

Conventional disposable shoe polishing kits, typically those which are utilized by a traveler and are normally found in hotels and motels, are relatively expensive and do not provide the desired configuration which makes them easily usable. In one arrangement, a polish applicator contains a barrier sheet between the folds and laminations of a folded structure. The barrier sheet is used to cover the shoe polish which normally is poured in heated form onto a folded sheet and is then cooled. An applicator portion is preferably positioned on the outermost portion of the folded pack with the coating of polish positioned outwardly therefrom. Alternatively, an applicator pad having a small disc or wafer thereon is positioned on a strip which can be folded. Wafers of polish are normally arranged in offset relationship lengthwise of the strip so as to prevent the wafers from overlapping one another. The aforementioned type arrangements have been utilized as disposable shoe polishing kits where it is desirable to apply polish to the shoes, rather than merely cleaning the shoes with a disposable chemical pack which can be rubbed on the shoes.

Typically, the prior art arrangements either saturated a pad with the shoe polish or the polish itself was positioned in a raised portion of the polishing kit. Such arrangements have been found to be unsatisfactory in view of the fact that where the'polish was formed in a raised portion of the kit, the polish itself was easily broken by handling. Alternatively, where the'polish is utilized to saturate layers of material, the resultant shine has been found to be unsatisfactory in view of the limited amount of polish available for shining, in addition to being expensive to manufacture.

The present invention provides a protective structure which enables the polish to be stored safely for prolonged periods of time without dehydrating or breaking the polish. When it is desired to use the polish, a protective layer is removed, thus exposing the polish for use.

SUMMARY OF THE INVENTION A polishing folder kit comprises a base layer of material and a receptacle layer superimposed on the base layer having a recess formed therein. Polishing material is positioned in the recess and a protective layer of material superimposed on the receptacle layer for preventing transfer of the polishing material from the recess prior to removal of the protective layer.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of the shoe polishing kit made in accordance with the invention;

FIG. 2 is an assembled view of the shoe polishing kit in a stored position; and

FIG. 3 is an assembled view of the shoe polishing kit of FIG. 1 with the kit in an open position, ready for use.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring now to the drawings, there is shown in FIG. 1 an exploded perspective view of a polishing kit 12 made in accordance with the principles of the invention. The polishing kit 12 comprises an outer folder 14 having a bottom portion 16, one end of which is integrally formed with a flap 18 having a free end 22. The other end of the bottom portion is integrally formed with a securing tab 24. The folder 114 is typically configured in a manner similar to a conventional match book cover with a staple 26 utilized to position the securing tab 24 with respect to the bottom portion 16.

A base layer 32 having a width equal to the width of the bottom portion 16 is superimposed thereon and has a length slightly smaller than the length of the bottom portion 16. Superimposed on top of the base layer 32 is a receptacle layer 34 having a circular recess 36 formed therein. Typically, the base layer 32 and the receptacle layer can be formed of cardboard or other paper-type material, although plastic or similar material can be used as well. The base layer 32 and the receptacle layer are illustrated as separate layers, but could be formed of a single integral layer if desired. Positioned within the recess 36 is conventional shoe polish 38 which is normally slightly heated so that it can be easily poured into the recess and allowed to cool and harden. The polish 38 is poured into the recess 36 so that when it is cooled, the top surface thereof will not protrude over the top surface of the receptacle layer 34.

Secured on top of the receptacle layer 34 is a thin layer of protective material 42 which may be formed of pressure adhesive material or the like. The pressure adhesive material typically may be cellophane, which is clear plastic and enables the user to determine the color of the polish as well as to prevent dehydration and drying of the shoe polish 38. By utilizing the layer of protective material 42, drying and cracking of the polishing material will not occur. In addition, the protective layer may be easily removed when it is desired to use the polish 38.

A short section of spacer material 44 is positioned between the bottom surface of the securing tab 24 and the top surface of the receptacle layer 34 and may be secured thereto by means of the staple 26. As can be seen in FIG. 2, when the staple 26 is inserted into the securing tab 24, the spacer material 44, the receptacle layer 34, and the base layer 32 are thereby secured to the bottom portion 16 of the folder 14.

An applicator pad 48 is then positioned over the protective material 42 and is inserted under the securing tab 24. The applicator pad has a height equal to the thickness of the spacer material 44 so that the thickness of the entire package remains relatively even. The applicator pad 48 which is normally formed of a felt layer may be made secured by the staple 26 or formed integral with the spacer material 44. A serrated connection can be formed between the spacer material 44 and the applicator pad 48 so that the pad can be firmly secured in the folder yet easily removed therefrom. After the entire kit is assembled as shown in FIG. 2, the free end 22 of the flap 18 is inserted under the securing tab 24 and the kit is ready for distribution or storage.

When it is desired to use the shoe polish 38 on a pair of shoes or other leather material, the flap 18 is opened in a conventional manner, such as by opening a match book cover. As shown in FIG. 3, the flap 18 may be folded back, enabling the applicator pad 48 to be removed. Then t'he protective material 42 is removed, exposing the shoe polish 38. The applicator pad 48 is then rubbed in the shoe polish until it is sufficiently saturated with polish so that itmay be applied to the item which is to be shined. The applicator pad 48 may be made of feltor similar material having a porosity that continued rubbing of the polish onto the object to be polished enables the'applicator pad to both apply the polish and then with further rubbing provide the desired shine. Of course, a brush or other shoe polishing cloth could be used to shine the article as well.

The polish 38 in the recess 36 could be conventional brown or black shoe polish, or may be of neutral shade enabling use on both'brown, black or other color leather-like material as well. The entire package is relatively inexpensive and enables the packages to be carried and used by a traveler and be readily disposable. In addition, the outer surface of the folder 14 enables advertising to be placed thereon, such as by a motel or hotel which provides such items free as goodwill.

I claim:

l. A shoe polishing folder kit comprising:

a base layer of material;

a receptacle layer having a recess formed therein superimposed on said base layer;

. polishing material positioned in said recess;

a protective layer of material superimposed on said receptacle layer for preventing transfer of said polishing material in said recess prior to removal of said protective layer; and wherein said polishing material extends in said recess from the top surface of said base layer adjacent said receptacle layer to the surface of said receptacle layer adjacent said protective layer. 

1. A shoe polishing folder kit comprising: a base layer of material; a receptacle layer having a recess formed therein superimposed on said base layer; polishing material positioned in said recess; a protective layer of material superimposed on said receptacle layer for preventing transfer of said polishing material in said recess prior to removal of said protective layer; and wherein said polishing material extends in said recess from the top surface of said base layer adjacent said receptacle layer to the surface of said receptacle layer adjacent said protective layer. 